Pengaruh Tebal Sirip Terhadap Distribusi Temperature Pada Heatsink Dengan Menggunakan Metode Steady-State Thermal
DOI:
https://doi.org/10.65244/jggengineering.v2i2.1054Keywords:
ANSYS, distribusi temperatur, heatsink, simulasi termal, tebal siripAbstract
Heatsink merupakan komponen penting dalam sistem pendinginan perangkat elektronik untuk menjaga kinerja dan keandalannya. Efektivitas heatsink dipengaruhi oleh parameter geometrisnya, salah satunya tebal sirip, yang masih jarang dikaji secara khusus pengaruhnya terhadap distribusi temperatur. Penelitian ini bertujuan mengetahui pengaruh tebal sirip terhadap distribusi temperatur pada heatsink menggunakan simulasi termal ANSYS. Metode yang digunakan adalah simulasi numerik berbasis Finite Element Method dengan modul Steady-State Thermal pada ANSYS 2020 R1, dengan memvariasikan tebal sirip sebesar 3 mm, 5 mm, dan 7 mm pada model heatsink dengan jumlah sirip tetap sebanyak 7 buah. Hasil simulasi menunjukkan bahwa semakin tebal sirip, temperatur maksimum semakin menurun, yaitu dari 52,707°C pada variasi 3 mm menjadi 50,794°C pada variasi 7 mm, disertai distribusi temperatur yang semakin merata. Variasi tebal sirip 7 mm menghasilkan performa termal terbaik dengan temperatur puncak terendah dan distribusi panas paling homogen, sehingga dapat direkomendasikan sebagai ketebalan sirip yang lebih optimal untuk mendukung efisiensi pendinginan komponen elektronik.
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